• Bondtester Advanced Automated Wafer Testing
  • Bondtester Advanced Automated Wafer Testing
  • Bondtester Advanced Automated Wafer Testing
  • Bondtester Advanced Automated Wafer Testing
  • Bondtester Advanced Automated Wafer Testing
  • Bondtester Advanced Automated Wafer Testing

Bondtester Advanced Automated Wafer Testing

Warranty: 12 Month Excellent After Service
Usage: Universal Textile Testing, Textile Fabric Testing
Automatic Grade: Automatic
Appearance Quality Testing Machine Type: Bondtester
Fabric Style Testing Machine Type: Bondtesting
Technological Characteristic Testing Machine Type: Bondtest
Customization:
Gold Member Since 2022

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Overview

Basic Info.

Model NO.
XHL-04XT
Textile Fabric Testing Machine Type
Bond Tester
Universal Textile Testing Machine Type
Automated Wafer Testing
Certification
CE, ISO9001: 2000
Condition
New
After-sales Service
12 Month Excellent After Service
Model
Xhl-04xt
Transport Package
Plywood Case
Specification
automated
Trademark
XHINSTRUMENTS
Origin
China
HS Code
9024800000
Production Capacity
100 PCS/ Year

Product Description

Product Description

Bondtester Advanced Automated Wafer Testing

 

The XH Instruments XHL-04XT multi-purpose bondtester is at the forefront of wafer testing technology catering for the testing of wafers,combining technology with the latest automation software delivers unparalleled accuracy, repeatability and results stability.

Principle:

Move the test head to the top of the test sample through the left and right joysticks. During the test, the Z -axis automatically moves down. When the test needle is touched to the surface of the test substrate, Z will stop moving after get signal, Z- axis will move up to the preset shear height . The Y -axis moves at a preset constant speed to perform shear test,  When the sample breaks, it automatically stops and the test data is displayed.

Test Standard: 

JEITA EIAJ ET-7407, JEDEC JESD22-B117A, JEDEC JESD22-B11, JEDEC JESD22-B116, ASTM F1269, DT/NDT MIL STD 883, MIL STD 883, MIL STD 883 ,JEDEC JESD22-B109 ..etc

Technical Parameter:
 
Push test module Test accuracy: ±0.25%
Pull test module Test accuracy: ±0.25%
Sampling Frequency More than 5000Hz
Various Test Mode Wire pull,Vector pull, Tweezer pull, Cold bump pull, ball share, peel, die shear..etc
Capacity According to different test
X-axis Travel: 200mm, Resolution: 0.001mm
Y-axis Travel: 160mm, Resolution: 0.001mm
Z-axis .Travel: 60mm, Resolution: 0.001mm
Test Platform Can be used with various grips (can be customized)
Operation PC operation, can display several groups graphs, out put, statistic, save
Air Pressure 0.4-0.6Mpa
Dimension L660xW355xH590mm
Weight ≤100KG
Power Supply 110V/220V, 50Hz/60Hz
 
 
Recommendend Products
Bondtester Advanced Automated Wafer Testing

 

Company Profile

Bondtester Advanced Automated Wafer TestingBondtester Advanced Automated Wafer Testing
 

Packaging & Shipping

Bondtester Advanced Automated Wafer Testing

FAQ

Bondtester Advanced Automated Wafer Testing


1. How About Machines Calibration?
Answer: All machines is calibrated well in house before it is out of factory, XH Instruments  will provide you calibration report, if you need calibration certificate from third party, such as ISO 17025 certificate, we also can provide you with extra charge.

2. What about delivery way and delivery item?
Answer: Courier Express  Delivery, Sea  Delivery,  Air Delivery.
EXW Works, FOB, C&F, CIF, ClP, CPT, FCA, DDU.

3. How can I pay you?
Answer:Bank TT, Western Union, L/C, Paypal.

4. How about you after service?
Answer: XH Instruments will give a feedback within 24 hours.Warranty Period is 12 Months.
For problem caused by product quality within warranty period,XH Instruments will provide product maintenance, technical support, freight out and home as well as spare parts free of charge.
Problem not caused by product quality within warranty period or maintenance beyond warranty period is only charged for replaced parts. However, freight charges home and out are at customer' side (only the replaced part is charged if transportation of instrument is unnecessary).

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